The NRTEC team will be attending PACK EXPO International 2024 in Chicago, USA, where we will showcase our innovative and sustainable packaging solutions.
As an important global event for packaging and processing technology, PACK EXPO International 2024 will provide us with an excellent platform to showcase our
latest products and solutions.
Our booth is located in Hall No. Lakeside Lowe, Booth No. LL9226 and we will showcase the following products:
1. Innovative paper void filling machine NP-EC760
In fact, intelligent and industrialized packaging equipment can simultaneously process single-layer or double-layer kraft paper into a strong
and durable kraft paper pad, helping companies reduce waste and optimize the packaging process. The cross-bundling method can more effectively
protect the transported items and is more suitable for large-volume and assembly line packaging and transportation companies.
2. Sustainable buffer protection solution for honeycomb paper dispensers
HP-S1 can match honeycomb packing paper rolls of different widths according to demand, such as 30cm/38cm/50cm, etc., which will not be restricted by
the width of the honeycomb packing paper. It is also an environmentally friendly and cost-effective alternative to plastic bubble packaging.
This buffer packaging material is created according to demand, saving valuable space and time in the process while providing excellent protection and perfect display.
3. Water activated tape dispenser carton sealing solution:
Tape-AT has a large capacity water tank of 2.5L and can choose the corresponding length of tape (reinforced kraft paper tape and ordinary kraft paper tape)
according to demand to provide high-density/safe and strong-adhesive carton sealing solutions for corrugated boxes, reducing the chance of packaging damage.
At PACK EXPO International 2024, our company will show how to help companies improve packaging efficiency, reduce costs, and achieve
environmental protection goals through these innovative and sustainable products.
Exhibition Details:
Exhibition Name: PACK EXPO International 2024
Date: November 3-6, 2024
Location: McCormick Place, Chicago
Our Booth: Hall No. Lakeside Lowe, Booth No. LL9226
We look forward to meeting you at PACK EXPO International 2024 to discuss the future of the packaging industry. Be sure to visit our booth
to learn how we can help your business grow and innovate.
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